King Sun PCB

From Concept to Manufacturing: Planning Multilayer PCB Stackups

Multilayer PCBs are essential for handling complex circuits in compact spaces. The arrangement of layers in a PCB stackup plays a crucial role in ensuring signal integrity, power stability, and minimizing interference. A well-planned stackup is key to optimizing performance and reliability in high-speed, high-density designs. This article delves into the
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Comparison and Analysis of ENEPIG and ENIG Processes

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) and ENIG (Electroless Nickel Immersion Gold) are two widely used surface treatments for PCBs. While both processes aim to improve the solderability, corrosion resistance, and long-term reliability of PCBs, they differ significantly in terms of process details, material choices, and performance characteristics.So what
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