COB wire bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip and a package pin or a gold-plated copper foil of the circuit board before packaging with a gold wire or aluminum wire.COB wire bonding is
Flexible circuits are used in various applications where conductors are connected to each other,these conductor interconnections must be bendable or be able to remain bent for long periods of use. In the past, this interconnect technology was implemented using wire interconnections.
There are many kinds of flexible circuits:
One is a two-way
With the continuous development of science and technology, PCB laser drilling is more and more widely used.Here, let the flexible circuit board manufacturers introduce the following 2 intuitive phenomena: what is PCB laser drilling and the matters needing attention.
How does laser produce?
Laser is a gas mixture gas in a closed circular space (see below table)
The present situation
Printed circuit boards cannot be reassembled after assembly, the cost loss is very high caused by microvoid.The problem is due to PCB design defect lead to weldability,it has been verified by the original equipment manufacturer (OEM).It has nothing to do with immersion silver or other final surface treatments.
Root cause analysis
By analyzing the root cause of defects,
The early process of Rigid-flex PCB board is use connector or hotbar process to connect two PCBs with flex board.This combination with the flex board and rigid PCB process is time-consuming and laborious, so customers transfer the assembly to PCB manufacturer to make rigid-flex PCB.
In addition to the price, the use of Rigid-flex Board has many advantages, listed as follows:
It can effectively save the space on the circuit board and save the use of the connector or the HotBar process
Because of flex PCB and rigid PCB get together, so that require the use of connectors or HotBar process space can be saved, saved space is
Ceramic circuit board and Metal PCB are good in heat dissipation of PCB board.The application of the traditional LED heat dissipation substrate,Metal Core PCB (MCPCB) is different from the application range of ceramic heat dissipation substrate.MCPCB is mainly used in the system circuit board.The ceramic circuit board is applied to the LED chip
All PCB board looks almost same from the surface.Through the surface we see differences, and these differences are crucial to the durability and function of the PCB board throughout life.
It is essential that the PCB board have reliable performance both in the manufacturing process and in the actual use.In addition to the relevant
What is backdrilling?
In the high speed signal transmission printed circuit board, part copper of vias becomes the signal transmission"tail" (Stubs),adverse effects on signal transmission,in order achieve better signal integrity, it is necessary to reduce the length of the Stubs in vias,shorter length of the residual Stubs is better for integrity of the signal.
Backdrilling
The warpage of the circuit board will cause the inaccurate positioning of the components.When the PCB is bent at SMT and THT process, the foot of the components are not in line, which will bring many difficulties to the assembly and installation work.
The maximum warpage or distortion of the IPC-6012,
The difference between ENIG and Gold plating on PCB circuit board?
The ENIG and the Gold plating are commonly used in PCB circuit boards. The Gold plating has been widely applied in electronic products due to the advantages of high hardness, wear resistance and no oxidation.ENIG is generated by chemical redox reaction and create a layer of gold
