When troubleshooting non-functional or poor performance circuits, engineers can run simulations or other analysis tools to consider the circuit from the schematic level. If these methods can not solve the problem, even the best engineers may be stumped and frustrated or confused. To avoid a similar dead end, I'll introduce
Prepreg, also known as pre impregnated material or bond sheet, it’s the main laminating material used in multilayer printed boards manufacturer. It is a type of thin sheet material made up of resins and reinforced. Reinforcement materials can be divided into glass cloth and other composite materials. Resins include epoxy
Printed circuit boards are a key element of various businesses, especially in the digital age when electronic technology is so important in many different areas. Different types of printed circuit boards also come in different types, depending on the needs of a particular company or industry, may have different materials,
When designing a PCB to factory fabrication, how to choose PCB material?
PCB material classification:
According to different materials (the most commonly used classification method)
Paper substrate (FR-1, FR-2, FR-3)
Epoxy glass cloth substrate (FR-4, FR-5)
Composite Substrates (CEM-1, CEM-3)
HDI sheet (RCC)
Special substrates (metal substrates, ceramic substrates, thermoplastic substrates, etc.)
Divided by resin
Phenolphthalein resin board
Epoxy board
Polyester
PCB vias are the electrical connections between layers. Vias are handled in the following ways:
PCB vias be covered:
Standard: Over-line holes must be covered, normal screen-printed solder resisted, no special plug-hole treatment;
Plug, part of the hole is not plugged, must accept the mouth of the yellow, but does not receive the
COB wire bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip and a package pin or a gold-plated copper foil of the circuit board before packaging with a gold wire or aluminum wire.COB wire bonding is
Flexible circuits are used in various applications where conductors are connected to each other,these conductor interconnections must be bendable or be able to remain bent for long periods of use. In the past, this interconnect technology was implemented using wire interconnections.
There are many kinds of flexible circuits:
One is a two-way
With the continuous development of science and technology, PCB laser drilling is more and more widely used.Here, let the flexible circuit board manufacturers introduce the following 2 intuitive phenomena: what is PCB laser drilling and the matters needing attention.
How does laser produce?
Laser is a gas mixture gas in a closed circular space (see below table)
The present situation
Printed circuit boards cannot be reassembled after assembly, the cost loss is very high caused by microvoid.The problem is due to PCB design defect lead to weldability,it has been verified by the original equipment manufacturer (OEM).It has nothing to do with immersion silver or other final surface treatments.
Root cause analysis
By analyzing the root cause of defects,
The early process of Rigid-flex PCB board is use connector or hotbar process to connect two PCBs with flex board.This combination with the flex board and rigid PCB process is time-consuming and laborious, so customers transfer the assembly to PCB manufacturer to make rigid-flex PCB.
In addition to the price, the use of Rigid-flex Board has many advantages, listed as follows:
It can effectively save the space on the circuit board and save the use of the connector or the HotBar process
Because of flex PCB and rigid PCB get together, so that require the use of connectors or HotBar process space can be saved, saved space is
