King Sun PCB

Understanding the Flexible PCB Fabrication Process: A Comprehensive Guide

The manufacturing process of flexible PCB involves multiple precise process links, from design, material selection to lamination, drilling, electroplating, etching, etc. Each step requires a high degree of precision and technical requirements. Understanding these manufacturing processes not only helps to improve product quality, but also promotes new application innovations. In this
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A Step-by-Step Process of PCB Via Drilling and Plating

PCB vias can transfer electrical signals between different layers, and they are an indispensable part of complex circuit design. However, the process of drilling and plating vias is intricate and must be done with precision to ensure the quality and reliability of the final product. In this article, we will walk
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Understanding of PCB Immersion Gold Technology

The surface treatment of PCBs directly affects their performance, reliability, and production cost. Among the various surface treatment technologies, Immersion Gold (ENIG) has become one of the most widely used and efficient processes. This article will provide a comprehensive understanding of the PCB immersion gold technology, covering everything from design to
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Thermal Management Technology of Aluminum-Based PCB

As electronic devices become more powerful, effective heat management is crucial for maintaining performance and longevity. Aluminum-based printed circuit boards (Al-PCBs) offer an efficient solution, thanks to their high thermal conductivity. This article explores the thermal management technology of aluminum-based PCBs from the perspective of thermal conductivity, analyzing material characteristics, design
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Comparison of OSP PCBs and Other Surface Finishes

OSP (Organic Solderability Preservative) is one such surface finish that has gained popularity in PCB manufacturing. However, how does OSP compare to more traditional surface finishes? What unique advantages and limitations does OSP offer? This article provides a comprehensive comparison of OSP with other common PCB surface finishes to help engineers,
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Surface-Mount vs. Through-Hole: Which Technology is Better for PCB Assembly?

In electronics manufacturing, selecting the right PCB assembly technology is crucial for product performance, cost, and production efficiency. Two of the most commonly used assembly techniques—Surface-Mount Technology (SMT) and Through-Hole Technology (THT)—each offer distinct advantages and are suitable for different applications. In this article, we will explore the key differences between
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Comparative of Laser Direct Imaging and Traditional Exposure Technology in PCB Fabrication

Among the various technologies used for pattern transfer, Laser Direct Imaging (LDI) and traditional exposure technology are the two main methods. Both play a crucial role in PCB production, but due to their distinct technical characteristics and advantages, choosing the right method is essential for optimizing manufacturing efficiency and product
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The Future of PCB Prototyping: Laser Technology Explained

Introduction: Overview of Laser Prototyping Technology Definition and Development History of Laser Prototyping Laser prototyping technology is a cutting-edge manufacturing method that uses precise laser beams to cut, engrave, and drill materials to rapidly create high-precision PCB (Printed Circuit Board) prototypes. This technology emerged in the 1970s and has gradually found its
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