In recent months,PCB material cost is continual increase lead to China PCB enterprisers are in difficult situation. Especially price soared of copper foil,copper ball,glass fibre,epoxy resin have exceeded the limit of maximum cost of printed circuit enterprises. In pass 10 years, PCB enterprises have cut the price to bottom for
HDI PCB is High Density Interconnection PCB, It widely used in small BGA board as its more advantages:
Increased interconnection density by miniaturization of holes,pads and conductors.
Provides the possibility to have a via hole connect direct in the SMD or BGA pad.
Improved signal integrity due to reduced tracklength.
New PCB designer always confuse how to build the min trace width and space for heavy copper PCB. Now PCB manufacturer engineer tell you how to do?
The min. trace width/space at inner layer :
The min. trace width/space at outer layer:
More PCB knowledge, please visit www.kingsunpcb.com
PCB resin plug via always has voids problems, it lead to solder area reduce and bring soldering reliability problems.The article analyses the generation factors of voids and how to improve it?
Via in pad technology is used in high frequency design to reduce inductance and increase density, means via plug is
It's very important how to calculate impedance value before PCB fabrication.
What is impedance?
Impedance is the total resistance of alternating current produced at known frequency.it's resistance sum of signal layer and reference plane.
Impedance Type
Characteristic impedance
Characteristic impedance is the ratio of voltage and current of a single wave propagating along the line.Signal produces reflection in the impedance discontinuity
PCB surface treatment ensure circuit board had good solderability or electrical property.Due to the nature of the copper oxide form tend to be in the air, it’s impossible to maintain the original copper,so copper requiring additional processing. Below is the most popular PCB surface treatment.
HASL and HASL-LF
HASL is hot air
Some comments for select PCB materials:
For electronic products, using FR4 epoxy fiberglass materials.
For high temperature application or flexible circuit board, using polyimide materials.
For high-frequency circuit, using Rogers or Teflon materials.
For high heat dissipation products, using metal core materials,like Al based material.
Five factors we should consider when
