Gold finger PCB design purpose: through the connector plug as the board of external contacts output, so gold finger process is needed.
The characteristics of gold: it has superior conductivity, wear resistance, oxidation resistance and reduce contact resistance. But gold is very expensive, so it is only used for partial gold plating or chemical
Everyone has discussed the circuit board, that what is green layer(solder welding, green oil), what to do (to prevent welding process, solder paste and copper surface contact caused by short circuit)?
First of all, the main component of green oil is resin + green paint. Of course the resin is not green by
The surface of the circuit board has several processes: Bare PCB (surface without any treatment), Rosin board, OSP (organic solder preservative, slightly better than rosin), HASL (a tin, lead free tin), gold plating, ENIG(Electroless Nickel/Immersion Gold), which is more common. We briefly introduce the difference between gold plating and ENIG.
ENIG is a method of
PCB surface finishing OSP is abbreviation of Organic Solderability Preservatives. It grows a layer of organic film on clean bare copper surface through chemical method.This layer film has features like anti-oxidation,heat shock,moisture resistance, it can protect the circuit board copper don’t be oxidized or vulcanized,etc.But the protective film must be
