King Sun PCB

BGA PCB-feature

BGA PCB:

Layers : 6 Layer
PCB Material: FR4
Board Thickness: 0.8mm
Surface Finishing: ENIG
Finished Copper thickness: 1/1/1/1/1/1 OZ

Special Process:
BGA pad 0.25mm
Min trace wdith/space 3/3mil

Standard PCB Capability:

Minimum Circuit Trace Width/Space: 2.7/2.7mil
The Minimum Via Size : 0.15mm
The Minimum legend Height/Width: 0.5mm/0.12mm
Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin
Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling
Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide
Maximum Panel Dimension: 1200mm x 600mm
Final Board Thickness: 0.4mm ~ 6.0mm
Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ
Solder Mask Colour: Green White Black Red Blue Yellow
Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation
Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole
Quote Now

 

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