BGA PCB:
Layers : 6 Layer
PCB Material: FR4
Board Thickness: 0.8mm
Surface Finishing: ENIG
Finished Copper thickness: 1/1/1/1/1/1 OZ
Special Process:
BGA pad 0.25mm
Min trace wdith/space 3/3mil
Standard PCB Capability:
| Minimum Circuit Trace Width/Space: 2.7/2.7mil |
| The Minimum Via Size : 0.15mm |
| The Minimum legend Height/Width: 0.5mm/0.12mm |
| Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin |
| Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling |
| Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide |
| Maximum Panel Dimension: 1200mm x 600mm |
| Final Board Thickness: 0.4mm ~ 6.0mm |
| Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ |
| Solder Mask Colour: Green White Black Red Blue Yellow |
| Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation |
| Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole |
