Blind and Buried Vias:
PCB Layer: 12 Layer
Material: FR4 High TG
Board thickness: 5.0mm,
Finishing copper thickness: inner and outer 1/1oz,
Surface finished: Hard Gold plating.
Special technology:
- Hard Gold plating, gold thickness 30u”
- Blind & Buried vias.
HDI&Microvia(blindburied) PCB Capability:
| Minimum Circuit Trace Width/Space: 2.7/2.7mil |
| The Minimum Via Size : 0.1mm |
| The Minimum legend Height/Width: 0.5mm/0.12mm |
| Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin |
| Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling |
| Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide |
| Maximum Panel Dimension: 1200mm x 600mm |
| Final Board Thickness: 0.4mm ~ 6.0mm |
| Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ |
| FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm |
| Solder Mask Colour: Green White Black Red Blue Yellow |
| Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation |
| Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole |
