Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole
Advantages:
Service:
4 Layer PCB Assembly: Chip-on-board (COB) Surface-mount technology (SMT) Ball-grid array (BGA) Through-hole Advantages: One-stop service included PCB fabrication and PCBA. Components sourcing Cost-effective Min
Rigid-flex PCB connector: Layers : 4 Layer PCB Material: FR4 High Tg, Polyimide FPC thickness:0.15mm Rigid Board Thickness: 1.6mm Surface Finishing: Immersin Sn Finished Copper
Infrared digital thermometer PCB Layers : 2 Layer PCB Material: FR4 Board Thickness: 1.6mm Surface Finishing: OSP Finished Copper thickness: 1/1OZ Solder mask: Green color,
Copper Core PCB with 3 OZ copper thickness Layers : Single Layer PCB Material: Copper core Board Thickness: 3.0mm Surface Finishing: OSP Finished Copper thickness: