Flex circuit board:
Layers : 2 Layer
PCB Material: ADH 20um/PI 25um RA
Board Thickness: 0.2mm
Surface Finishing: ENIG
Finished Copper thickness: 1/1 OZ
Profile: Laser
Flex PCB Capability:
| Layer Type: Single Layer,2 Layer, 4 Layer, 6 Layer |
| The minimum Trace Width/Space: 0.035/0.035mm for 1/3OZ, 0.06/0.06mm for 1/2OZ, 0.1/0.1mm for 1/1OZ. |
| The maximum FPC Dimension: 250x140mm |
| The minimum FPC Dimension: 5x8mm |
| The minimum FPC Thickness: 0.06mm+/-0.03mm |
| The minimum FPC via: 0.1mm |
| The FPC Copper Thickness: 1/3 oz, H OZ, 1 OZ |
| The Standard material PI Thickness: 13/18/20/25/50um |
| The Coverlay Thickness: 12.5um, 25um |
| The FPC Stiffener Type: PI stiffener 12.5/25/50/75/100/125/150/200/250um,PET stiffener 0.125/0.188/0.25um,FR4 stiffener 0.1~1.0mm,Stainless Steel stiffener 0.1~0.3mm |
| Surface Finishing: ENIG, Immersion Tin,ENEPIG,Plated Tin,Plated Nickel, Plated Gold,Immersion Nickel |
