ROHS PCB Assembly：
Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole
Advantages:
- One-stop service included PCB fabrication and PCBA.
- Components sourcing
- Cost-effective
- Min order 1 pcs
Service:
- PCB fabrication
- Component sourcing
PCB Assembly Capability：
| The Minimum PCB Dimension: 50x40mm |
| The Maximum PCB Dimension：600x400mm |
| The Maximum Component Height: 25mm |
| The Maximum PCB Weight: 3KG |
| The Minimum Components Size: 0201(0.5×0.25mm),Flip-CHIP,QFP,BGA,POP |
| The Maximum Components Size: 55mm |
| The Minimum PCB Dimension: 50x40mm |
| The Maximum PCB Dimension : 510x460mm |
| The BGA/QFP pitch :0.3mm |
| Testing: ICT, Burn-in, Function Test,Temperature Cycling |
