King Sun PCB

MCPCB-feature

Do You Know The Difference Between FR4 PCB And MCPCB?

FR4 PCB is made of epoxy resin plus filler (Filler) and glass fiber, it has good insulation, corrosion resistance, compression, multilayer printing and so on.It is widely used in communication, automobile, medical, industrial control, security and other fields.The glass fiber board is divided into half glass fiber board and full glass fiber board according to the material.

Aluminum substrate PCB(also MCPCB) is a kind of PCB, metal based printed board, with high thermal conductivity, good heat dissipation function.The general single layer MCPCB is composed of three layers of structure, which are the circuit layer (copper foil), the insulating layer and the metal base.Used for high-end use is also designed as a double-sided plate, the structure of the circuit layer, insulation layer, aluminum, insulation layer, circuit layer.Very few are used as multi-layer layer, which can be made up of ordinary multilayer with insulating layer and aluminum base.

The application field of aluminum substrate(MCPCB):

  • Audio equipment: input and output amplifier, balance amplifier, audio amplifier, preamplifier, power amplifier and so on.
  • Power supply equipment: switch regulator `DC/AC converter `SW adjuster and so on.
  • Communication electronic equipment: high frequency amplifier, filter circuit, electrical telegraphy.
  • Office automation equipment: motor drive and so on.
  • Automobile: electronic regulator, igniter,power controller and so on.
  • Computer: CPU board “floppy disk drive” power supply device and so on.
  • Power module: converter, solid relay, rectifier bridge and so on.
  • Lamps and lanterns: with the promotion of energy-saving lamps, all kinds of energy-saving LED lamps have been greatly welcomed by the market. The aluminum substrates used for LED lamps have also begun to be widely applied.

Price pricing for FR4 PCB and aluminum substrate PCB（MCPCB）:

  • The thickness of the glass fiber board FR4 is 0.2mm (ultra thin). 0.4mm, 0.6mm. 0.8mm. 1. 0mm,1.2mm. 1.6mm. 2. 3mm. 3.2mm. It is necessary to explain the impedance PCB and blind burial board, the more difficult the more expensive the price will be.
  • The thinnest aluminum substrate thick can be 0.3 mm, and the thermal conductibility is 1.0W/m.k, 2.0W/m.k, 3.0W/m.k, the higher thermal conductibility, the price is higher.
  • The price of the PCB board included facets,like material, thickness, process and appearance, and the number of holes. The price of the super hole or extra long board will be raised a little bit. If the shape is hard to do, it will also adjust the price.

On the whole, the price of aluminum substrate PCB(MCPCB) is more expensive, and the aluminum substrate PCB(MCPCB) can not be plating through holes.

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PCB impedance-feature

How To Design Impedance Matching PCB Circuit Board?

Impedance matching is a suitable matching method between the signal source or the transmission line and the load.According to the impedance matching of the access mode, there are two ways of serial and parallel. According to the frequency impedance matching of the signal source, it can be divided into two kinds of low frequency and high frequency.

(1.) High frequency signals generally use serial impedance matching. The resistance value of the serial resistance is 20~75 Ω, and resistance value is proportional to the frequency of the signal, and is inversely proportional to the width of the PCB line.In the embedded system, the serial matching resistance should be added when the frequency is larger than 20M and the length of PCB line is more than 5cm.For example, the clock signal, the data and the address bus signal in the system. There are two functions of the serial matching resistance in the design of the circuit board.

  • Reduce high frequency noise and edge overshoot. If the edge of a signal is very steep, it contains a large number of high frequency components, which will interfere with radiation.In addition, it is easy to produce overshoot.The series resistance, the distributed capacitance of the signal line and the load input capacitance form a RC circuit, which will reduce the steep edge of the signal.
  • Reduce high frequency reflection and self excited oscillation. When the frequency of the signal is very high, the wavelength of the signal is very short.When the length of the wavelength is comparable to the length of the transmission line, the reflection signal will change the shape of the original signal on the original signal.If the characteristic impedance of the transmission line is not equal to the load impedance (that is, the mismatch), the reflection will be produced at the load end, causing the self excited oscillation.The low frequency signal in the PCB board is directly connected, and the serial matching resistance is not required.

(2.) Parallel impedance matching is called “terminal impedance matching”,It is usually used at the end of the input / output interface, which mainly refers to the impedance matching with the transmission cable.For example, LVDS and RS422/485 use the input – end matching resistance of the 5 kind of twisted pair lines to be 100~120Ω,The matching resistance of a video signal using a coaxial cable is 75 Ωor 50 Ω and an article flat cable is 300 Ω. The resistance value of the parallel matching resistance is related to the medium of the transmission cable, which is independent of the length, and its main function is to prevent the reflection of the signal and reduce the self excited oscillation.

It is worth mentioning that impedance matching can improve the EMI performance of the system.Besides,not only series/parallel circuit can solve impedance transformation but also use transformer shunt resistor, typical examples include Ethernet interface, CAN bus and so on.

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PCB solder question-feature

How To Avoid PCB Wrap?

The warpage of the circuit board will cause the inaccurate positioning of the components.When the PCB is bent at SMT and THT process, the foot of the components are not in line, which will bring many difficulties to the assembly and installation work.

The maximum warpage or distortion of the IPC-6012, SMB–SMT’s PCB is 0.75%, and the other board is generally not more than 1.5%.The allowable warpage (double-sided / multilayer) of the electronic assembly plant is usually 0.70—0.75% (1.6mm plate thickness). In fact, many boards, such as SMB and BGA boards, require warpage less than 0.5%, and some factories even less than 0.3%; PC-TM-650 2.4.22B.

Calculation of warpage = warping height / edge length

Prevention of warpage of PCB:

  • Engineering design: interlayer prepreg arrangement should be corresponded; multilayer board and prepreg should use the same supplier product; outer layer C/S side copper area as close as possible, independent grid can be adopted.
  • Bake the PCB material before sheet cuting:
  • Outlayer and innter layer need excluded the moisture in the plate and solidify the resin and eliminate the stress in the plate with 6-10 hours in 150 degree before material baking.
  • Attention the prepreg direction of latitude and longitude before the multilayer lamination:
  • The shrink ratio is different of latitude and longitude. Attention the prepreg and core direction of latitude and longitude before sheet cuting.In general curable sheet direction is longitude, and the long direction copper clad plate is latitude.
  • Cold pressure,trim the edge after lamination.
  • Baking the plate with 4 hours by 150 degree before drilling process.
  • Thin PCB is better no mechanical abrasion, and chemical cleaning is recommended. Special fixture is used to prevent bending and folding of plate.
  • HASL PCBs naturally cooled to room temperature or air floatation bed to be cleaned after cooling.

Warping board treatment:

Use smooth steel plate heavy pressure with 150 degrees or hot press 3–6 hours, 2-3 times baking.

More PCB inquiry, please send email to us: info@kingsunpcb.com

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Immersion Gold PCB

PCB Surface Finishing ENIG vs Gold plating vs HASL

The difference between ENIG and Gold plating on PCB circuit board?

  • The ENIG and the Gold plating are commonly used in PCB circuit boards. The Gold plating has been widely applied in electronic products due to the advantages of high hardness, wear resistance and no oxidation.ENIG is generated by chemical redox reaction and create a layer of gold coating. It can be thick gold layer.
  • The gold thickness of ENIG is much thicker than Gold plating, The crystal structure formed by the two are different,Gold will be golden yellow than Gold plating.
  • Because of the different crystal structure formed by ENIG and Gold plating, ENIG is easier to weld than Gold plating, and it will not cause welding defect.It is also because ENIG is more soft than Gold plating, so gold finger PCBs are generally plated with hard gold.
  • The ENIG only has nickel gold on the pad, the signal transmission in copper area does not affect in the skin effect.
  • The crystal structure of ENIG is more compact than Gold plating, and it is not easy to produce oxidation.
  • As the wiring becomes more and more dense, the line width and spacing have reached 3-4mil, Gold plating can easily lead to the short circuit of gold wire,The ENIG only has nickel gold on the pad, so it will not produce a short circuit of gold wire.
  • The ENIG has nickel gold only on the pad, so the soldermask on the line is more firm with the copper layer. CAM editing will not affect the spacing when it is compensated.
  • The ENIG is used in advanced board, the flatness is better, and the black mat phenomenon after the assembly will not appear.

The above is the difference between the ENIG and the gold-plating. Now the gold price is high. In order to save costs, many manufacturers are reluctant to produce gold plating boards, and only do the ENIG.

Why do not “HASL” in general?

As the integration of IC gets higher and higher, the more IC feet are more denser. However, it is difficult for the vertical tin spraying process to make the slender pad smooth, which makes it difficult for the SMT to mount.In addition HASL inactive shelf life is a short life. And gold plates just solve these problems.

  • For the surface mount technology, especially for the 0603 and 0402 super miniature sheets, because the flatness of the pad is directly related to the quality of the solder paste printing process, which plays a decisive role in the quality of the reflow soldering. Therefore, the whole plate gold plating is often seen in the high density and super small surface bonding process.
  • At the trial stage, affected by factors such as the component purchasing tend not to immediately board welding, but often have to wait a few weeks or even months before use.Engineer prefer to use gold PCB as gold plate shelf life is many times longer than HASL,besides the gold cost is not much difference compared with HASL in PCB prototype.
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FLEX PCB

How To Manufacture FPC Board?

The production process of a flexible printed circuit board is basically similar rigid PCB.For some operations, the flexibility of the laminates requires different devices and completely different processing methods.Most flexible PCB uses a negative method.However, there are some difficulties in the machining of flexible laminated plates and in the process of coaxial processing.One of the main problems is the processing of the base material. Flexible materials are rolls of different width, so during the etching, the flexible laminates need to be used as a rigid bracket.

In the process of production, the processing and cleaning of the flexible printed circuit is more important than the rigid plate.Incorrect cleaning or violation of regulations may lead to failure in product manufacturing. This is due to the sensitivity of materials used in flexible printed circuit. In the manufacturing process, flexible printed circuit plays an important role.The substrate is affected by mechanical pressure such as wax drying, lamination and electroplating. Copper foil is also susceptible to percussion and dent, and the extension ensures maximum flexibility. Mechanical damage or hardening of copper foil will reduce the flexibility life of the circuit.

During the manufacturing period, a typical flexible single side circuit needs to be cleaned at least three times. However, multiple substrates need to be cleaned 3-6 times because of its complexity.In contrast, rigid multilayer printed circuit boards may require the same number of cleaning times, but the cleaning procedure is different, so we need to be more careful when cleaning flexible materials.Even by light pressure in the cleaning process, the spatial stability of flexible materials will also be affected, and will cause the panel elongated in the Z or Y direction, depending on the bias pressure. The chemical cleaning of the flexible printed circuit board should pay attention to the environmental protection. The cleaning process includes alkaline bath, thorough rinsing, micro etching, and final cleaning.The damage of thin film often occurs in the process of panel mounting, when it is stirred in the pool, the rack is removed from the pool, or the surface tension is not destroyed when it is not on the shelf.

Punching holes are generally used in the holes in the flexible plate, which leads to the increase of the processing cost. Drilling is also possible, but this requires special adjustment of drilling parameters, so as to obtain the hole wall without smear. After drilling, the drilled dirt is removed in a water cleaner with ultrasonic stirring.

Mass production of flexible panels is cheaper than rigid printed circuit board.This is because flexible laminates enable manufacturers to produce circuits on a continuous basis. This process starts directly from laminates, and directly generates finished products.In order to fabricate printed circuit boards and etch a continuous processing schematic diagram of flexible printed circuit boards, all production processes are completed in a series of sequential placement machines. Screen printing may not be part of the continuous transmission process, which causes an interruption of the online process.

Usually, because of the heat resistance of the substrate, the welding in the flexible printed circuit is more important.Manual welding requires sufficient experience, so if possible, wave soldering should be used. In welding flexible printed circuit, the following matters should be paid attention to:

  • Because polyimide is hygroscopic, the circuit must be baked before welding (continuous 1h in 250 F)
  • The pads are placed on large conductor areas, such as ground layer, power layer, or radiator, which should be reduce heat emission and makes the welding easier.
  • When a hand welding pin is carried out in a dense area, it is necessary to avoid continuous welding of the adjacent pins and move the welding back and forth in order to avoid local overheating.
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High Frequency PCB-feature

How To Control High Frequency PCB Mix Pressure Technology?

With the rapid development of electronic communication technology, in order to realize high speed and high fidelity transmission of signal, more and more high-frequency circuit boards are used in communication equipment.The dielectric materials used in the high frequency board have excellent electrical properties and good chemical stability, which are mainly shown in the following four aspects:

  • It has the characteristics of small signal transmission loss, short transmission delay time and small signal transmission distortion.
  • It has excellent dielectric properties (mainly: low relative dielectric constant -Dk, low dielectric loss factor- Df). In addition, the dielectric properties (Dk, Df) remain stable under the environment of frequency, humidity and temperature.
  • High precision control of impedance (Zo)
  • It has excellent heat resistance (Tg), processing formability and adaptability.

Based on the above characteristics, the high frequency PCB board is widely used in wireless antenna, base station receiving antenna, power amplifier, components (shunt, confluence, filter), radar system, navigation system and other communication devices.

The design of multilayer high frequency PCB based on cost saving, bending strength and electromagnetic interference control. It is often appearance by high frequency hybrid PCB.The selection of high frequency mixed pressure material and the design of the composite structure are varied and enumerate。King Sun through research and development, a 6 laminate was produced by experiment, and the mixed pressure of high frequency material RO4350B/RO4450B and FR4 was combined.

The test results show that the design of the high frequency mixed pressure plate is based on one or more factors in the control of the cost saving, the improvement of the bending strength and the control of the electromagnetic interference.It is necessary to use high frequency prepreg with low resin fluidity and smooth FR-4 substrate on the medium surface during the press process. In such a case, there is a great risk for the product’s caking control during the press process.

The experimental results show that the key technologies such as FR-4 A material, plate edge flow block, flow retarding block design, compression retarding material usage and press parameter control are selected. The bonding property between the mixed pressure material is good, and the reliability of the circuit board is not abnormal.

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backdrill-feature

How Did PCB Backdrill Offset Happened And The Effect For Product

To understand the back drilling offset,It is necessary to understand how to PCB board process.then know the details of any affects of product performance from design to production process.For “back drilling offset”, let us talk about what is “back drill”, “back drill” is a process for vias,the aim is shorten the via stub and prevent the resonance by via stub appeared in signal concerned frequency band to ensure or improve the performance of the product.

The first to see how the vias that need to be backdrill are implemented step by step, as shown in the following figure:

backdrill-fig1

In view of the “back drill” above drawing process, since it is one of the production process, there must be a deviation, and the following are the errors caused by the back drill

Back drill depth deviation

The perfect situation for the back drilling is to drill down all the stub below the outlet layer.But the production is hard to 100% precision, in order not to hurt the line layer, must keep a certain distance from the line layer, we call it a safe distance.Therefore, there is no perfect situation, and the stub will remain 2mil~12mil after drilling.

Assuming that via outlet layer is in layer4, the back drill will be set from bottom-to-layer5 in the PCB file.It means to do back drill from the bottom layer to layer4 but not to hurt layer4,after doing this, the length of the stub is up to 12mil.At this point, even with FR4 material, the resonance caused by stub is also over 80GHz, and there is no effect on the current 25Gbps/28Gbps signals.

However, if the product is not designed correctly, the back drilling layer is not set correctly, or it can’t be set from bottom-to-layer5 for other factors.For example, avoid the back drill to damage the other layers, or to ensure the connection strength of the connector, only set the back drill  from bottom-to-layer7.The over hole stub in the design itself has 25mil, the back drilling deviation of the processing is 12mil, and the final product’s over hole stub may be 37mil.The resonance of the 37mil’s via stub will be about 30GHz.Does the depth deviation of the back drill have a fatal deterioration to your product at this time?Does the system have sufficient margin to resist the deterioration? This needs to be prejudged at the stage of product design avoid panic after the event.

Back drilling diameter deviation

The deviation of back drilling diameter is the deviation of the size of the hole formed by the back drill.In addition to deviation from the depth of the drilling process, the back drilling diameter is also deviation, it is easy to understood.The drilling tool is like electronic drills, and they have many types in size.For example, the via diameter of finished product 0.2mm needs backing drilling. Generally, 0.45mm specification drill is selected, and the drill bit itself has certain tolerance range, such as 0.45mm+/-0.025mm.What is the effect of the deviation of the back drill diameter on the product, we will answer later.

Back drill position deviation

Although back drilling is based on location information, drilling holes through holes one by one, however, the alignment accuracy of backdrilling is less than 100% by affected accuracy.It’s like you drill with an electric drill on the wall, although you have made a positioning mark on the wall before, but 100 holes are drilled, and there are some holes that will deviation a little bit.

We will consider the effects of the deviation of back drill diameter and the deviation of back drilling position on the product get together.Because the deviation of diameter and the position deviation will occur at the same time as long as the back drill,when the via need to be drilled is open around, then the backdrill is easy, The only requirement is drill down the via stub.But if there is a line near via, it is possible to drill down the line.The line is partially drilled makes the line width become small, and then the impedance of the line is raised.

It is impossible to avoid the deviation from production, but we can avoid the effect of deviation on the performance of the product at the early stage.For example, the deviation of the depth of the back drill: the reasonable arrangement of the overlay of the via and the optimization of the stack to minimize the stub caused by the design itself;The back drilling diameter deviation + position deviation: set a constraint design stage, the safe distance from the other signal line to the distance is more than back drilling production and processing requirements.

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PCB factory-feature

How To Choose Reliable PCB Factory?

High precision electronic products usually go through three stages: R &D, trial production, mass production, then how to choose the PCB factory at different phase?

Many PCB circuit designers and purchases can’t find the right suppliers.

  1. PCB prototype

Low price with bad quality,high quality with high price

  1. Mass production

Big factory don’t need small batch order,also bad service. The small factory quality is not guaranteed.

When we choose PCB manufacturers, we have to make clear the market orientation of each supplier, so that we can get reasonable price and good service. Otherwise, you can only run into a brick wall, then choose a compromise, and sometimes it makes it difficult for you.

Some of the problems that will be encountered in the R & D phase, race running with time, repeated tests. Most of the time is the customer chasing the bottom run, sometimes have to get through carelessly.

There is a misunderstanding, that is, the time, the quality of the product and the production speed of board is related to a certain extent. For example, 1-2 days expedite, factory will ignore some important inspection process or reduce testing standards when making, so the quality of products will be discounted when they are handed over to R & D people. But because the R & D people have to test the performance and effect for product in short time, the demand is still in the market.

It is often haste makes waste. When developer finish welding components and they fail to achieve the test results, they will spend a very long time of investigation, which is much longer than using quality guaranteed PCB. Instead, it makes a lot of trouble for the R & D cycle. Therefore, the comprehensive consideration of the economy and speed,quality guarantee is better than other choice. Some factories provide slower cycles than other manufacturers. This is not because they have lower standards, mainly because the technology level needs to be improved.

For example, the 2 Layer PCB prototype production cycle is reasonable in 3-7 days. Such a factory can guarantee the quality of the product, and can also provide a small batch of 5-20 square meters in this time range for the customer’s needs. At the same time, the price will not be very low at USD100~185/SQM, If some manufacturers give you a cheaper price, you should pay special attention to the quality of the product.

If you have much more money and a reasonable development plan, it is necessary to choose some PCB manufacturers with stable delivery and quality assurance. Why do you say that?

This kind of single plant blindly fast, low prices to customers. 60%-70% PCBs will have  problems in the test, no matter what considerations, this loss is not only influence the development cycle, as well as the company’s honor, are more likely to have crisis of people’s life.

When your factory is in the stage of promotion, when the product is on trial production, it is necessary to avoid a lot of customer complaints. The more the customer complaints, the greater the impact on your product market. Now the electronic market is changing fast, and many times just because of a small device, a small PCB can lead to big loss of customers.

Making a product like human behave, a small shortcoming will kill many advantages. When we save the cost for the company, we should also consider the reputation of the company and the subsequent product cost.

When your products are finished development and small batch, go to the market stage, you should also choose a reliable partner to make the company Evergreen.

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PCB board repair-feature

How To Repair PCB Circuit Board?

Analysis of PCB failure phenomena

  • Incomplete statistics of the fault parts of the circuit board: The chip is damaged by 30%; the discrete element is damaged by 30%; the connection (PCB plate copper wire) breaks 30%; the program destroys or loses 10% (there is an upward trend).
  • It is known from the above that when there is a problem in connecting the circuit boards and programs, there will be no good boards, also not familiar with its connection. There is not much possibility of repairing PCB board.

Crystal oscillator

  • Usually only the oscilloscope (crystal oscillator need electricity) or frequency meter test, the multimeter can not be measured, otherwise the substitution method can only be adopted.
  • The common faults of crystal oscillator are internal leakage, internal opening, metamorphic frequency deviation, and peripheral capacitance leakage. The leakage phenomenon here is measured by the VI curve of the < tester >.
  • When the whole PCB board is testing, two kinds of methods can be used: in the vicinity of the crystal oscillator, the related chips are not passed, and other fault points are not found except the crystal vibration.
  • There are two kinds of common crystal: two pins,four pins which the second feet is power, attention can not be short

Function and parameter test

  • The detection of the device can only reflect the cut-off area, the amplification area and the saturation area, but can not measure the working frequency and the specific speed.
  • Similarly, for TTL digital chips, only can know the output changes of high and low levels, and the speed of its rising and falling edges can not be detected.

Reset circuit

  • When there is a large scale integrated circuit on the circuit board need to be repaired, the problem of reset should be paid attention .
  • Before testing, it is best to install it back on the equipment, try the machine again and again, and press several reset keys.

Chip with program

  • EPROM chip is generally not damaged, because it need UV to remove chip program, so the program will not damage in the test, but the data said that due to the production of chip materials, with the passage of time (year long) it’s also possible damaged even without use (mainly refers to the program) ,so try to backup the data
  • EEPROM, SPROM, and RAM chips with batteries are very easy to destroy. Whether or not this type of chip has broken the program after the use of the “test instrument >” for VI curve scanning, has not been decided yet. In spite of this, friends are still very careful when they meet this situation.
  • On a circuit board with a battery – based chip, do not easily remove it from the board.

More PCB technology ,please vist www.kingsunpcb.com

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PCB gerber-feature

How PCB Output Gerber Files And Assembly Files?

What kind of documents is needed for the PCB factory to make the board?

  • As PCB design is confidential, so PCB gerber file which is unified industry standard file is required, PCB factory can use CAM software input PCB gerbr file.
  • Mechanism diagram: long width thickness and its tolerance requirements, as well as square holes and slot and some odd shape mechanism sizes. In accordance with the manufacturing process of PCB plant, do not be too strict, too strict will only increase the cost. The mode punching is not the same as the tolerance of CNC.
  • Process Description: the number of layers, the color of solder mask, the color of the character, the requirement of the surface treatment, the quantity, the delivery time and so on.

If PCB need be sent to assembly factory to make PCBA,then below files are necessary.

  1. Bom list included components list
  2. Non welding list
  3. SMT coordinate file
  4. Components schematic diagram
  5. Manual welding list
  6. Stencil file

How to output gerber files from PCB design file?

  1. Gerber file output for PCB file designed with Altium designer

Open “Gerber Files” option

File—>Fabrication Outputs—>Gerber Files

PCB Gerber file output

PCB assembly files:

Bom list

Reports—>Bill of Material

Non welding list

According to the list of first step components

The methods and steps for the output of SMT coordinate files

  • Open a PCB file: File—>Open
  • TopLayer—>Edit—>Select—>All on Layer,
  • BottomLayer—>Edit—>Select—>All on Layer
  • After then press button “Shift+Delete” to delete the redundant circuits of Top and bottom layer.
  • Select [ Design / Options…],open the layers button,tick the [Toplayer]/[BottomLayer] of Singal Layers,then tick [Top Overlay]/[BottomLayer] of Silkscreen,then tick [Keepout] of Other. Note: you also can turn off Top and Bottom individual, it’s more clearer.
  • After the above steps have been completed, it clearly show the position of the pad screen printing.
  • Select [Edit / Origin / Set] to set the location of the origin (* set the location of the PCB origin, remember the location of the PCB origin on the machine should also be set here).
  • Select [File/CAM Manager..] ,then select “Pick Place”, tick “Text”, and always point to the next step, the unit chooses “Metric”, completes generating a “Pick Place” file, and selects “F9 Generate CAM Generate”.
  • In the CAM for.. Directory of the [Explorer] window on the left, find the “Pick Place.. File”, and the right key to output to the target path you want.
  • Then open this Pick Place file with Excel and collate it into the files that SMT needs, in which Mid X and Mid Y are X, Y coordinates required by SMT.

          Note: TopLayer and BottomLayer should be separated when they are arranged

Position screen map of product components

  • Schematic diagram of surface parameters

The top surface parameters indicate the resistance of the TopOverlay layer, the resistance of the capacitance, the IC, the capacity value, the name of the IC, and so on (10K, 1UF. MAX354 etc.)

Note: all the parameters are best in the middle (within the plate screen).

Steps and methods

  1. A . Open a PCB file in DXP
  2. Select only TopOverlay and KeepOutLayer
  3. Hide the number of the components, display only the parameter, put the parameters of each component in the plate screen, and put it in the middle, and pay attention to the consistency of the tidy and the direction.
  4. Select [File/Smart PDF]. ] export to a PDF file
  • Top numbering schematic

The numbering of the top surface is the number of the resistance, capacitance, and IC of the TopOverlay layer (R1, C1, U1, etc.)

Note: the best numbers are in the middle (within the plate screen).

Steps and methods:

  1. Open a PCB file in DXP
  2. Select only TopOverlay and KeepOutLayer
  3. Hide the component parameters, only display the number, put the number of each component in the plate screen, put it in the middle, and pay attention to the consistency of the tidy and the direction.
  4. Select [File/Smart PDF]. ] export to a PDF file
  • Manual welding device list

Collate according to the list of BOM tables

  • PCB stencil file

Provide by hardware department.

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