King Sun PCB

Increased demand for high density, versatility, and miniaturization brings new challenges to packaging and substrates. Many new packaging technologies have emerged, including embedded packaging technology. Embedded packaging technology is to embed passive components such as resistors, capacitors, inductors and even active devices such as IC in printed circuit boards. This approach can shorten the length of lines between components, improve electrical characteristics, and increase the effective printed circuit board package area. Reducing the number of solder joints on the printed circuit board surface, thereby increasing the reliability of the package and reducing the cost, is an ideal high-density packaging technology.

According to Kingsun engineers, early embedded technology was mainly used on PCBs and now also on package substrates. Embedding passive devices such as resistors and capacitors in the PCB is already a very mature technology. The embedded technology is transferred from the PCB to the substrate, which is more difficult to implement because the finer substrate and thinner breakdown thickness require more manufacturing processing capability and higher precision. However, due to the same technical principle, its passive devices embedded in the substrate have also rapidly achieved mass production.

There are mainly two kinds of passive components such as embedded resistors and capacitors in the substrate. One is planar inlay, also called film-type buried, Only a few micrometers of resistance and capacitance materials are embedded in the board, and corresponding resistance or capacitance patterns are created through a series of processes such as pattern transfer and acid etching. Another method is to separate embedded resistors and capacitors such as 01005, 0201, 0402 and other ultra-thin package specifications directly through the SMT process and fill-hole interconnection process into the substrate. There is no limitation on the number of embedded components in the embedded package. The size of the package is mainly based on the area of the package. If the area is sufficient, it can be buried. Although this approach will increase the packaging cost, it may not necessarily increase the cost of the entire product, because it can save the cost of component purchases and SMT placement, and it will also improve the performance.

In addition to embedding passive components such as resistors, capacitors, and inductors, our company is actively developing embedded IC technology that directly embeds the die into the substrate to carry out board-level packaging, which is more complicated than embedding passive components. After long-term technology accumulation and innovation, the company has already produced samples of IC-embedded substrates. The next step is to jointly develop with customers and define the final products according to their needs.

The demand for high-density and miniaturized packaging continues to increase. It is expected that the market for built-in component substrates will continue to expand. The emergence of embedded technology contains the possibility of major changes in the industrial structure and industrial structure. From material factories, IC foundries, IC design companies, to printed circuit board/substrate manufacturers, packaging manufacturers, and system manufacturers, that is, upstream and downstream of the industrial chain. Collaboration is indispensable. According to industry insiders, “The development of embedded technology has had a great impact on the original device suppliers. At this time, they need to change, for example, their devices need to meet the embedded conditions. New technologies will surely break the inherent pattern. It is very important for enterprises to timely understand the changes in the market and timely transition. ”