The warpage of the circuit board will cause the inaccurate positioning of the components.When the PCB is bent at SMT and THT process, the foot of the components are not in line, which will bring many difficulties to the assembly and installation work.
The maximum warpage or distortion of the IPC-6012, SMB–SMT’s PCB is 0.75%, and the other board is generally not more than 1.5%.The allowable warpage (double-sided / multilayer) of the electronic assembly plant is usually 0.70—0.75% (1.6mm plate thickness). In fact, many boards, such as SMB and BGA boards, require warpage less than 0.5%, and some factories even less than 0.3%; PC-TM-650 2.4.22B.
Calculation of warpage = warping height / edge length
Prevention of warpage of PCB:
Warping board treatment:
Use smooth steel plate heavy pressure with 150 degrees or hot press 3–6 hours, 2-3 times baking.
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