Rogers PCB RO4003C RO4350B material are high-frequency material type produced by Rogers company. Unlike the traditional FR4 PCB board, they don’t have glass fiber in the middle material and use the ceramic base for high-frequency material.
Rogers RO4350B and RO4003C are the most common series materials in the Rogers family. They are used in the manufacture of Rogers PCB as hard and dense material properties. Widely used in high-frequency power distribution and CUP circuit boards, switches, connectors, etc.
RO4350B and RO4003C have superior dielectric constant and temperature stability, The dielectric constant thermal expansion is very consistent with the copper foil. It can be used to improve the deficiencies of PTFE substrate, Suitable for high-speed designs, as well as commercial microwave and RF applications.
Due to its extremely low water absorption, it can be used for high-humidity environments, providing customers in the high-frequency board industry with the highest quality materials and related resources, and fundamentally controlling product quality.
The Rogers PCB material RO4003C RO4350B contain an epoxy resin core, metal-clad copper, and aluminum element. They have good dimensions and advantages in thermal expansion coefficient, which can effectively control the temperature stress to ensure the stability of component performance.
They are most commonly used in RF PCB assembly because of their sensitivity to electromagnetic (EM) waves (usually in the radio spectrum). This helps reduce interference from other high-frequency devices such as radios, TVs, and cell phones.
Rogers PCB materials RO4003C RO4350B also have excellent dielectric integrity and are designed for use on high-performance RF circuit boards.
The materials have excellent electrical and thermal stability, making them are the ideal choice for harsh environments exposed to extreme temperatures and vibrations.
Rogers PCB materials can be manufactured in a variety of thicknesses and sizes, These thicknesses are the most common: 0.127mm,0.254mm,0.381mm,0.508mm,0.787mm,1.575mm,3.175mm.
This type of high frequency board is suit for applications where there is a small gap between traces. It provides good electrical performance, especially at higher frequencies.
This type of board also has better thermal properties than thin sheets, making it ideal for applications where heat dissipation is important.
Thin thickness rogers PCB have lower electrical losses than standard thickness PCB because they have increased surface area per unit area and therefore less electrical resistance.
They also offer better electrostatic discharge (ESD) protection than standard-thickness boards because they offer greater resistance when discharged by electrostatic charges.
Standard dielectrics in flex circuits are 0.001 – 0.002″. This relatively thin layer of material separates the copper traces and components in the flex circuit board.
The thickness of this layer determines how easily the material can be bent and bent without disrupting internal connections or causing short circuits.
The most common materials used to make this dielectric are polyester and polyamide materials. They are usually coated with a conductive material such as silver, aluminum or copper and act as electrical conductors between traces on the surface of the circuit board and between components.
RO3000 Series
Based on ceramic-filled PTFE circuit material, models are: RO3003, RO3006, RO3010, RO3035 high-frequency laminates.
RO4000 Series
RO4003C, RO4350B with Prepreg RO4450B RO4450F
RO4500
RT6000 Series
Based on ceramic-filled PTFE circuit material, it is designed for electronic circuits and microwave circuits that require high dielectric constant. The models are: RT6006 dielectric constant 6.15, RT6010 dielectric constant 10.2
TMM series
Composites based on ceramics, hydrocarbons, thermosetting polymers, types: TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i. etc.
Ordinary FR4 PCB is usually made of copper foil and substrate bonded, and the substrate material is mostly glass fiber (FR-4), phenolic resin (FR-3), aluminum base, copper base, PTFE, composite ceramics and other materials, sticky The mixture is usually phenolic, epoxy, etc. Due to thermal stress, chemical factors, improper production process, and other reasons during PCB processing, or due to the asymmetry of copper plating on both sides during the design process, it is easy to cause different warpage on the PCB board.
Because the Rogers RO4003C RO4350B itself is relatively hard, the heat dissipation performance is good, and the thermal expansion coefficient is low. At the same time, the Rogers RO4003C RO4350B PCB is bonded to the copper and the substrate by magnetron sputtering. The bonding force is strong, the copper foil will not fall off, and the reliability is high. , so as to avoid the warping problem of the PCB board.
RO4003C RO4350B are 100A current continuously passes through 1mm0.3mm thick copper body, the temperature rise is about 17℃; 100A current continuously passes through 2mm0.3mm thick copper body, the temperature rise is only about 5℃
The alumina thermal conductivity of Rogers RO4003C RO4350 PCB boards can reach 15~35, and the aluminum nitride can reach 170~23. Because in the case of high bonding strength, its thermal expansion coefficient will be more matched, and the tensile value of the test can reach 45 MPa
The high thermal conductivity aluminum substrate is generally 1-4W/M.K, Rogers RO4003C RO4350B PCB material can reach about 220W/M.K depending on the preparation method and material ingredients.
RO4003C RO4350B have good thermal resistance:
10×10mm ceramic substrate is 0.31K/W for a 0.63mm Rogers PCB material
0.19K/W for a 0.38mm Rogers PCB material.
0.14K/W for a 0.25mm Rogers PCB material.
Rogers PCB material RO4003C RO4350B have good insulation performance and high withstand voltage, guaranteeing personal safety and equipment. With strong bonding force, using bonding technology, the copper foil will not fall off, high reliable, and stable performance in high temperature and high humidity environments.
Rogers PCB material has stable high-frequency performance, AK and DK values are lower than PTFE.
Impedance stability is the difference between FR4 and Rogers PCB. The higher the dielectric constant, the higher the impedance stability.FR4 maximum dielectric constant is 4.5, Roger PCB RO4003C RO4350B have a higher and wider range of electric values from 6.5 to 11
In high-speed applications, PCB circuit board will generate a lot of heat and must be carefully handled with a good thermal management system. In this case Rogers PCB are the best choice. FR4 PCBs cannot handle high temperatures, so they will fail in such applications.
The dissipation factor represents the PCB signal loss, Rogers PCB material RO4003C RO4350B are much lower than FR4 PCB. FR4 PCB dissipation factor is 0.02%, and Rogers PCB dissipation factor is 0.004%.
Moisture absorption is directly related to the electrical and thermal properties of the substrate. This in turn affects the performance of the board. Rogers PCBs have the lowest moisture absorption and therefore provide the best efficiency in a wide range of environmental conditions.
Application and Performance Based on overall performance, FR4 PCB is considered an good substrate, while Rogers RO4003C RO4350B PCB are excellent. Therefore, FR4 PCBs are best suited to be used in the optimum environment for mid and low-frequency applications. But Roger PCB is used for high performance in niche areas such as space applications.
With its advantages, Rogers PCB has been used in high-power power electronic modules, solar panel components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace, military electronic products, high-power LED lighting products, communication antennas, automotive Widely used in sensors, cooling chips and other fields.
High-power power electronic modules
Solar panel components
High-frequency switching power supplies