If the vias is too close to pad, solder will flow out through via when make reflow soldering,lead to false weld.
Countermeasure: Move vias to 0.2mm far away from pad.
This kind of question always happened to PCB design. Engineer had to save space for boards limited by dimension. But it may lead to serious problem for SMT.
Any other PCB technology knowledge: www.kingsunpcb.com