The high in difference of heavy copper PCB is easy lead to oil float away,fake copper exposure,oil uneven when printed solder mask if controlled unwell.This article analysed and improved this problem through line mask printing area, solder mask opening of silkscreen ,printing lay up time and printing method.
The traditional process:
Pre-treatment—>solder mask printing—>lay up (2-3hrs)—>Pre-baking—>inspection—>exposure—>developing—>inspection—>solder mask oil solidifying—>Pre-treatment—>second solder mask printing—> lay up(2hrs)—>Pre-baking—>inspection—>exposure—>developing—>inspection—>solidifying
The shortcoming of traditional process:
Technology and Reliability
Evaluated Technology: occured above questions as the big altitude difference,oil piled up too heavy, whether can squeeze out bubble at lay up process,reduce lay up time,we improved the technology process as below:
Through improved the process,we can save produce time 3-4hours.Put boards into vacuum machine and squeeze out air bubble can complete solve the solder mask bubble problem.
Quality is acceptable after vacuum squeezed bubble.
Through improvement of the process, it save produce time 3-4hrs and simplified process,improved quality,enhanced productivity,reduce cost,improved the delivery and competitive capacity.
More PCB technology knowledge please contact: info@kingsunpcb.com.
High-frequency PCB and high-speed signal transmission lines should avoid routing at 90 degree corners, which…
Solder defects often delay new product launches,What factors will affect the poor soldering of the…
Why PCB Thermal management is important? For electronic devices, a certain amount of heat will be generated during…
The factors that cause the welding defects of flexible circuit boards have the following three…
How to choose how many layers of boards are used for design and how to…
When the PCB design is completed, the laminate layer is determined, and the PCB board…