In electronics manufacturing, selecting the right PCB assembly technology is crucial for product performance, cost, and production efficiency. Two of the most commonly used assembly techniques—Surface-Mount Technology (SMT) and Through-Hole Technology (THT)—each offer distinct advantages and are suitable for different applications.
In this article, we will explore the key differences between
Surface Mount Technology (SMT) is the dominant method for assembling printed circuit boards (PCBs) in modern electronics. The design process of a Surface Mount PCB involves several stages, from creating an initial schematic to the final product assembly. Each step plays a crucial role in ensuring the board’s performance, reliability,
SMT is abbreviation of surface mount technology and is currently the most popular technology and process in the electronics assembly industry. Surface Mount Technology (SMT) is called surface mount or surface mount technology. It is a method of mounting a leadless or short lead surface mount component (SMC/SMD for short)
let's learn about the standard shortcomings of quality testing.
Serious shortcomings (in CR): any shortcoming enough to harm the human body or machine or to endanger the safety of life, such as unconformity / burning / electric shock, etc.
The main shortcomings (in MA): can cause damage to the product,
