| Item |
Technical Parameters |
Specification |
| Min Circuit Line Width/Space |
3/2.7 mil |
Finished Copper Thickness H oz |
| Min PCB Pad Ring of Via |
3 mil |
Distance between hole edge to ring outskirt |
| Min PCB Pad Ring of PTH |
5 mil |
Distance between hole edge to ring outskirt |
| Min PCB Via Size |
4 mil |
Board Thickness < 1.2 mm |
| Min PCB Thickness of Double sided |
0.2 mm |
Final Board Thickness |
| Min PCB Thickness of Multilayer |
0.4 mm |
Final Board Thickness |
| Max PCB Thickness |
8.0 mm |
Final Board Thickness |
| Max PCB Dimension |
609×609 mm |
Single and Double Sided PCB |
| Space Between Line to Board Edge |
10 mil |
Milling of Outline |
| Max PCB Layers |
30 Layer |
|
| PCB Solder Mask Color |
Green,Black,Blue,Red,white,Yellow, |
|
| PCB Silkscreen Color |
White,black,yellow |
|
| PCB Surface Finishing |
HASL,ENIG,ENEPIG,ImAg,ImTin,OSP, Hard Gold Plating |
|
| Max Finishing Copper Thickness |
6 oz |
|
| Dielectric Thickness |
2.5 mil |
|
| PCB Material |
FR-4,Aluminium substrate,Rogers4350C,Polyimide |
|
| Special Technology |
HDI PCB, Via in Pad PCB,Blind&Buried PCB |
|