PCB surface finishing OSP is abbreviation of Organic Solderability Preservatives. It grows a layer of organic film on clean bare copper surface through chemical method.This layer film has features like anti-oxidation,heat shock,moisture resistance, it can protect the circuit board copper don’t be oxidized or vulcanized,etc.But the protective film must be cleared instantly in the subsequent high temperature welding,so that the exposed clean copper immediately combines into to a solid solder joints with melting solder in a very short time.
The process of OSP:
Degreasing—>Washing—>Micro-Etching—>Washing—>Pickling—>Pure water washing—>OSP—>Pure water washing—> Drying
OSP Principle:
An organic film is formed on the surface of printed circuit board,firmly protects the fresh copper surface,and also be anti-oxidation and pollution at high temperatures.OSP film thickness is generally controlled at 0.2-0.5 microns.
Features of OSP:
The types of OSP
Disadvantages
Storage method and time
Vacuum packaging for 6 months(temperature 15-35℃,humidity RH≤60%)
SMT site requirements
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