What Is PCB Laser Drilling And Application

With the continuous development of science and technology, PCB laser drilling is more and more widely used.Here, let the flexible circuit board manufacturers introduce the following 2 intuitive phenomena: what is PCB laser drilling and the matters needing attention.

1. How does laser produce?

Laser is a gas mixture gas in a closed circular space (see below table) under the strong fan’s wind.When the gas mixture passes through a charged ceramic electrode,the mixture gas make chemical reaction of molecular structure and reflect from the whole reflector,then form the laser beam and emit from the seismograph.

2. Why laser drillingburn thousands of holes in a second?

After the laser beam is generated, a series of refraction of light—> reflection—>splitting—> light correction and so on are needed.Finally, arrive at the electronic scanning mirror, and control the frequency of the X axis and the Y axis motor through the program with 2250 changes per second.Each time the frequency is changed, the position of the hole is changed, so that the holes with different coordinates can be reached. See below picture, a scanning mirror2. Why laser drillingburn thousands of holes in a second

3.Why gas mixtures are often replaced

When gas mixture gas passes through charged ceramic electrodes, the chemical reaction of molecular structure occurs.The composition of gas mixture which has been formed in a certain proportion has changed.Therefore,the mixed gas that has changed the structure will affect the generation of laser after long time used, lead to instability of laser will also affect the quality of hole burning.Therefore, we need to replace the gas quickly after 96 hours and replace it automatically after 720 hours.

4.How much small holes can be made by laser drilling?

According to the size range of the small hole, it is divided into six gears:

Small holes: 1 to 3 (mm);

Small holes: 0.40 to 1 (mm);

Ultra small holes: 0.1 to 0.40 (mm);

Micropores: 0.01 to 0.10 (mm);

Secondary micropores: 0.001 to 0.01 (mm);

Ultra micropores: <0.001 (mm).

5. Laser drilling applicable materials and industry applications:

• The laser drilling is mainly non-contact metal drilling.
• Ultramicropore punch
• The minimum via size can reach 0.01mm. It is suitable for punching of ordinary metals and alloys (all metals such as iron, copper, aluminum, magnesium, zinc, etc.), rare metals and alloys (gold, silver and titanium).