Ceramic circuit boards are actually made of electronic ceramic materials and can be made into various shapes.Among them, the ceramic circuit board has the characteristics of high temperature resistance and high electrical insulation performance, and has the advantages of low dielectric constant, low dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficients of components. Ceramic printed circuit boards are produced using laser rapid activation metallization technology LAM technology. Used in LED field, high power semiconductor modules, semiconductor coolers, electronic heaters, power control circuits, power mixing circuits, smart power components, high frequency switching power supplies, solid state relays, automotive electronics, communications, aerospace and military electronic components.
Unlike traditional FR-4 (glass fiber), ceramic materials have good high frequency performance and electrical properties, and have high thermal conductivity, chemical stability and thermal stability. Ideal packaging material for generating large scale integrated circuits and power electronics modules.
Main advantages:
1, the thermal conductivity is higher
2, a more matching coefficient of thermal expansion
3. A harder, lower resistance metal film alumina ceramic circuit board
4. The solderability of the substrate is good and the use temperature is high.
5, good insulation
6, low frequency loss
7, assembled at high density
8, free of organic components, resistant to cosmic rays, high aerospace reliability, long service life
9. The copper layer does not contain an oxide layer and can be used for a long time in a reducing atmosphere.
With the development of high-power electronic products in the direction of miniaturization and high speed, traditional FR-4, aluminum substrate and other substrate materials are no longer suitable for the development of high power and high power. With the advancement of science and technology, the intelligent application of the PCB industry. Traditional LTCC and DBC technologies are gradually being replaced by DPC and LAM technologies. Laser technology, represented by LAM technology, is more in line with the development of high-density interconnects and fineness of printed circuit boards. Laser drilling is the front end of the PCB industry and mainstream drilling technology. The technology is efficient, fast, accurate and has high application value. The RayMingceramic board is made with laser fast activation metallization technology. The bonding strength between the metal layer and the ceramic is high, the electrical properties are good, and the soldering can be repeated. The thickness of the metal layer can be adjusted in the range of 1 μm to 1 mm, and L/S resolution can be achieved. 20μm, which can be directly connected to provide customized solutions for customers.
Lateral Excitation of Atmospheric CO2 Laser This product was developed by a Canadian company and has an output power of one hundred to one thousand times compared to conventional lasers and is easy to manufacture. In the electromagnetic spectrum, the radio frequency is in the frequency range of 105-109 Hz, and with the development of military and aerospace technology, the second frequency is transmitted. The medium and small power RF CO2 lasers have excellent modulation performance, stable power and high operational reliability. Long life and other characteristics. UV solid YAG is widely used in plastics and metals in the microelectronics industry. Although the CO2 laser drilling process is more complicated, the production effect of micro-aperture is better than that of UV solid YAG, but CO2 laser has the advantages of high efficiency and high-speed stamping. The market share of PCB laser micro-hole processing can still be developed in domestic laser micro-hole manufacturing. At the stage, not many companies can put into production.
Domestic laser micro-hole manufacturing is still in the development stage. Short pulse and high peak power lasers are used to drill holes in the PCB substrate to achieve high density energy, material removal and micropore formation. Ablation is divided into photothermal ablation and photochemical ablation. Photothermal ablation refers to the process of forming pores by rapidly absorbing high-energy laser light through the substrate material. Photochemical ablation refers to a combination of high photon energy in the ultraviolet region of more than 2 eV electron volts and laser wavelengths in excess of 400 nm. The manufacturing process can effectively destroy the long molecular chain of the organic material, form smaller particles, and the particles can rapidly form micropores under the action of external force.
Today, China’s laser drilling technology has certain experience and technological progress. Compared with traditional stamping technology, laser drilling technology has high precision, high speed, high efficiency, large-scale batch punching, suitable for most soft and hard materials, without loss of tools and waste. The advantages of less material, environmental protection and no pollution.
The ceramic circuit board passes the laser drilling process, the bonding force between ceramic and metal is high, does not fall off, foaming, etc., and the effect of growth together, high surface flatness, roughness ratio of 0.1 micron to 0.3 micron, laser striking hole diameter From 0.15 mm to 0.5 mm, even 0.06 mm.